Microelectronic assemblies including stiffeners around individual dies

A microelectronic assembly, comprising:

• a package substrate;
• a die having a first surface, an opposing second surface, a first side surface, and an opposing second side surface, wherein the first and second side surfaces extend between the first surface and the second surface, and wherein the first surface of the die is electrically coupled to the package substrate by interconnects;
• a material surrounding the interconnects;
• and
• a component having a surface, a first sidewall, and a second sidewall, wherein the first and second sidewalls extend from the surface of the component, wherein the surface of the component is coupled to the second surface of the die, wherein the first and second sidewalls of the component extend along the respective first and second side surfaces of the die towards the package substrate, and wherein:
• the first and second sidewalls of the component are coupled to the package substrate by the material surrounding the interconnects;
• and
• the substrate further includes a trench and the first and second sidewalls of the component are partially disposed in the trench, wherein a material of the trench includes a solder mask.

A computing device, comprising:

• a circuit board;
• and
• an integrated circuit (IC) package electrically coupled to the circuit board, wherein the IC package comprises:
• a package substrate comprising a trench, wherein a material of the trench includes a solder mask;
• a stiffener surrounding a single die, wherein the stiffener includes a planar portion and two or more sides extending from the planar portion and partially disposed in the trench, and wherein the single die is electrically coupled to the package substrate by interconnects;
• and
• an underfill material surrounding the interconnects and coupling the two or more sides of the stiffener to the package substrate.