Method for manufacturing semiconductor device

A method for manufacturing a semiconductor device, comprising:

• preparing a plurality of semiconductor elements each including a first surface on which a connection terminal is formed and a second surface on a side opposite to the first surface;
• preparing a curable bonding adhesive layer and a carrier, wherein the curable bonding adhesive layer is formed on the carrier;
• attaching the plurality of semiconductor elements to the curable bonding adhesive layer such that the second surface of each of the plurality of semiconductor elements is directed toward the curable bonding adhesive layer;
• fixing the plurality of semiconductor elements to the curable bonding adhesive layer by curing the curable bonding adhesive layer;
• encapsulating the plurality of semiconductor elements on the curable bonding adhesive layer with an encapsulant material after curing the curable bonding adhesive layer, so as to bond the encapsulant material to a surface of the cured curable bonding adhesive layer;
• and
• removing the carrier by irradiating with laser, wherein the carrier is removed from the cured curable bonding adhesive layer,
• wherein a bonding adhesive strength between the cured curable bonding adhesive layer and the encapsulant material is 4.0 MPa or more,
• wherein a bonding adhesive strength of the cured curable bonding adhesive layer to the carrier is 1 MPa or more in the encapsulating, and
• wherein a bonding adhesive strength of the cured curable bonding adhesive layer to the carrier is 5 MPa or less when the cured curable bonding adhesive layer is irradiated with the laser in the removing.