Package structures with non-uniform interconnect features

A computer system comprising;

• a power supply;
• one or more integrated circuit packages coupled to the power supply, wherein at least one of the integrated circuit packages comprises:
• a substrate comprising one or more substrate pads;
• a first set of solder structures, wherein individual ones of the first set of solder structures are on individual ones of the substrate pads;
• a second set of solder structures, wherein individual ones of the second set of solder structures are on individual ones of the substrate pads, wherein the first set of solder structures are located on a peripheral region of the substrate and the second set of solder structures are located in a central region of the substrate, wherein the substrate pads on the central region of the substrate comprise a greater height than a height of the substrate pads on the peripheral region;
• a die comprising a first side and a second side, wherein the first side comprises one or more conductive die pads, wherein individual ones of the conductive die pads are on individual ones of the first set and the second set of solder structures, wherein a combined height of an individual one of the substrate pad, an individual one of the second set of solder structures and an individual one of the conductive die pads is greater than a combined height of an individual one of the substrate pads, an individual one of the first set of solder structures and an individual one of the conductive die pads;
• and
• a die backside layer on the second side of the die.