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US 12,604,748 B2Granted
Capacitor pads and methods of manufacturing the same
AssigneeIntel Corporation
InventorsKristof Darmawikarta, Jung Kyu Han, Srinivas Pietambaram, Rajeev Ranjan
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Abstract
Capacitor pads and methods of manufacturing the same are disclosed herein. An example apparatus disclosed herein includes a substrate to support a die, and a die-side capacitor pad on the substrate, the die-side capacitor pad including a plurality of distinct pad portions, the distinct pad portions spaced apart from one another.
Claims17
An apparatus comprising:
- a substrate to support a die;
- and
- a die-side capacitor pad on the substrate, the die-side capacitor pad including:
- a plurality of distinct pad portions, the distinct pad portions spaced apart from one another;
- and
- a frame around the plurality of the distinct pad portions, the frame to retain solder material associated with a die-side capacitor, the frame flush with at least one of the distinct pad portions.
3 more elements
An apparatus comprising:
- a substrate to support a die;
- a capacitor including a terminal;
- an interconnect extending between the capacitor and the substrate, the interconnect including a first pad on a side of the substrate, the first pad electrically coupling the die to the terminal, the first pad including a plurality of distinct pad portions, each of the distinct pad portions bonded to the terminal of the capacitor;
- and
- a second pad on the side of the substrate, the second pad to electrically couple the substrate to the die, a cross-sectional area of individual ones of the distinct pad portions being less than or equal to a cross-sectional area of the second pad.
2 more elements
Dependencies are inferred from the claim text.