Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device, comprising steps of:

• (a) preparing a lead frame including a first chip mounting portion;
• (b) supplying a first adhesive material of a conductive paste type containing a conductive filler onto the first chip mounting portion;
• (c) after the step of (b), mounting a first semiconductor chip on the first chip mounting portion via the first adhesive material such that a first back surface electrode of the first semiconductor chip faces the first chip mounting portion, the first semiconductor chip having a first front surface electrode and the first back surface electrode opposite the first front surface electrode;
• (d) after the step of (c), performing a first heat treatment for curing the first adhesive material;
• (e) after the step of (d), supplying a second adhesive material of a conductive paste type containing a conductive filler onto the first front surface electrode of the first semiconductor chip;
• (f) after the step of (e), disposing a first metal plate on the first front surface electrode of the first semiconductor chip such that the first metal plate faces the first front surface electrode of the first semiconductor chip via the second adhesive material;
• and
• (g) after the step of (f), performing a second heat treatment for curing each of the first adhesive material and the second adhesive material,
• wherein a time of the first heat treatment is less than a time of the second heat treatment, and
• wherein after the first adhesive material is cured by the first heat treatment in the step of (d), the first adhesive material is further cured by the second heat treatment in the step of (g).