Integration of glass core into electronic substrates for fine pitch die tiling

An electronic package, comprising:

• a package substrate, wherein the package substrate comprises:
• a core, wherein the core comprises glass, and wherein a first via passes through the core;
• a film over the core, wherein the film is an adhesive, wherein a second via is in the film, wherein the first via is in contact with the second via, wherein the second via tapers outwardly along a direction toward the first via, wherein the second via has a width greater than a width of the first via where the second via contacts the first via, and a conductive pad in the film, the conductive pad over and coupled to the second via, the conductive pad having a width greater than the width of the first via and greater than the width of the second via, and the conductive pad having a top surface at a same level as a top surface of the film;
• and
• buildup layers over the film, wherein a first level interconnect is provided over the buildup layers;
• and
• a die coupled to the package substrate by the first level interconnect.

An electronic system, comprising:

• a board;
• a package substrate coupled to the board, wherein the package substrate comprises:
• a core, wherein the core comprises glass;
• a film over the core, wherein the film is an adhesive;
• and
• buildup layers over the film, wherein a first via passes through the core and a second via is in the film, wherein the first via is in contact with the second via, wherein the second via tapers outwardly along a direction toward the first via, wherein the second via has a width greater than a width of the first via where the second via contacts the first via, and a conductive pad is in the film, the conductive pad over and coupled to the second via, the conductive pad having a width greater than the width of the first via and greater than the width of the second via, and the conductive pad having a top surface at a same level as a top surface of the film;
• and
• a die coupled to the package substrate.