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US 12,604,739 B2Granted
Semiconductor device and method of forming a 3-D stacked semiconductor package structure
AssigneeJCET STATS ChipPAC Korea Limited
InventorsSeungHyun Lee, YeJin Park, HeeSoo Lee
Life of this patent
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Abstract
A semiconductor device has a substrate and a first electrical component disposed over the substrate. An encapsulant is deposited over the first electrical component. A shielding layer is formed over the encapsulant. The shielding layer is patterned to form a conductive trace and a contact pad. A board-to-board (B2B) connector is disposed over the encapsulant and electrically coupled to the substrate by the conductive trace.
Claims22
A semiconductor device, comprising:
- a substrate including a portion of a conductive layer exposed at a side surface of the substrate;
- a first electrical component disposed over the substrate;
- an encapsulant deposited over the first electrical component;
- a shielding layer formed over a top surface of the encapsulant and a side surface of the encapsulant, wherein the shielding layer is patterned over the top surface of the encapsulant and the side surface of the encapsulant to form,
- a conductive trace that extends from the top surface of the encapsulant to the side surface of the encapsulant,
- a portion of the shielding layer at a first end of the conductive trace on the side surface of the encapsulant patterned to match a shape of the portion of the conductive layer of the substrate exposed at the side surface of the substrate, wherein the portion of the shielding layer is formed directly on the portion of the conductive layer over the substrate, and
- a contact pad at a second end of the conductive trace on the top surface of the encapsulant;
- and
- a B2B connector disposed over the encapsulant and electrically coupled to the substrate by the conductive trace.
6 more elements
A semiconductor device, comprising:
- a substrate;
- an encapsulant deposited over the substrate;
- a shielding layer formed over the encapsulant, wherein the shielding layer is patterned on a top surface of the encapsulant and a side surface of the encapsulant to form a conductive trace extending from the top surface of the encapsulant to the side surface of the encapsulant;
- and
- a first electrical component disposed over the encapsulant and electrically coupled to the substrate by the conductive trace.
2 more elements
A method of making a semiconductor device, comprising:
- providing a substrate including a portion of a conductive layer exposed at a side surface of the substrate;
- disposing a first electrical component over the substrate;
- depositing an encapsulant over the first electrical component;
- forming a shielding layer over a top surface of the encapsulant and a side surface of the encapsulant;
- patterning the shielding layer over the top surface of the encapsulant and the side surface of the encapsulant to form,
- a conductive trace that extends from the top surface of the encapsulant to the side surface of the encapsulant,
- a portion of the shielding layer at a first end of the conductive trace on the side surface of the encapsulant patterned to match a shape of the portion of the conductive layer of the substrate exposed at the side surface of the substrate, wherein the portion of the shielding layer is formed directly on the portion of the conductive layer over the substrate, and
- a contact pad at a second end of the conductive trace on the top surface of the encapsulant;
- and
- disposing a B2B connector over the encapsulant and electrically coupled to the substrate by the conductive trace.
7 more elements
A method of making a semiconductor device, comprising:
- providing a substrate;
- depositing an encapsulant over the substrate;
- forming a shielding layer over the encapsulant;
- patterning the shielding layer on a top surface of the encapsulant and a side surface of the encapsulant to form a conductive trace extending from the top surface of the encapsulant to the side surface of the encapsulant;
- and
- disposing a first electrical component over the encapsulant and electrically coupled to the substrate by the conductive trace.
3 more elements
Dependencies are inferred from the claim text.