Systems and methods for providing dynamic security fabric interposers in heterogeneously integrated systems
AssigneeThe Charles Stark Draper Laboratory, Inc.
InventorDouglas La Tulipe
Life of this patent
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Abstract
A system may include an integrated circuit (IC) package. The IC package may include one or more IC die hosting one or more circuits, and an interposer. The interposer may be coupled to the one or more IC die via an interconnection layer. The interposer may include one or more electrically active devices configured to provide one or more security functions to secure the one or more circuits. The interposer may be coupled to a backside power of the IC package. In some embodiments, the backside power of the IC package may include one or more backside power delivery networks.
Claims16
A system comprising an integrated circuit (IC) package, the IC package comprising:
- one or more IC die hosting one or more circuits;
- and
- an interposer coupled to the one or more IC die via an interconnection layer, the interposer comprising one or more electrically active devices configured to provide one or more security functions to secure the one or more circuits,
- wherein the interposer is coupled to a backside power of the IC package,
- the one or more IC die include a first IC die and a second IC die wherein the one or more electrically active devices are configured to provide a first connection structure with which the first IC die is connected to the second IC through the interposer, and
- in response to the first IC die being replaced with a third IC die, the one or more electrically active devices are configured to provide a second connection structure with which the third IC die is connected to the second IC through the interposer.
An interposer of an integrated circuit (IC) package that includes one or more IC die hosting one or more circuits, the interposer comprising:
- one or more electrically active devices configured to provide one or more security functions to secure the one or more circuits, wherein
- the interposer is coupled to a backside power of the IC package, and
- the interposer is coupled to the one or more IC die via an interconnection layer,
- wherein the one or more IC die include a first IC die and a second IC die wherein the one or more electrically active devices are configured to provide a first connection structure with which the first IC die is connected to the second IC through the interposer, and
- in response to the first IC die being replaced with a third IC die, the one or more electrically active devices are configured to provide a second connection structure with which the third IC die is connected to the second IC through the interposer.
A method comprising:
- mounting, on an interconnection layer, one or more integrated circuit (IC) die hosting one or more circuits
- forming an interposer to include one or more electrically active devices,
- coupling the interposer to the one or more IC die via the interconnection layer, the interposer configured to provide one or more security functions to secure the one or more circuits;
- and
- coupling a backside of the interposer to one or more backside power delivery networks,
- wherein the one or more IC die include a first IC die and a second IC die, and the method comprises:
- configuring the one or more electrically active devices to provide a first connection structure with which the first IC die is connected to the second IC through the interposer, and
- in response to the first IC die being replaced with a third IC die, configuring the one or more electrically active devices to provide a second connection structure with which the third IC die is connected to the second IC through the interposer.
Dependencies are inferred from the claim text.