Back to results
US 12,604,736 B2Granted
Shield to reduce substrate electromagnetic interference and warpage
AssigneeIntel Corporation
InventorsTelesphor Kamgaing, Chu Aun Lim, Eng Huat Goh, Min Suet Lim, Kavitha Nagarajan, Jooi Wah Wong, Chee Kheong Yoon
Life of this patent
Estimating the term…
Abstract
Embodiments herein relate to systems, apparatuses, techniques, or processes for stiffeners for a surface of a package substrate, where the stiffeners provide EMI/RFI shielding for signal traces or other electrical routings within the package, and in particular for traces at a surface of the package such as microstrip routings. Other embodiments may be described and/or claimed.
Claims24
An apparatus, comprising:
- a substrate with a first side and a second side opposite the first side;
- an electrically conductive trace proximate to the first side of the substrate;
- a structure over the first side of the substrate, the structure comprising a first portion extending in a first direction and a second portion extending in a second direction different than the first direction;
- wherein the first portion is at least partially over the electrically conductive trace;
- and
- wherein the structure is electrically coupled to a ground terminal, the ground terminal beneath the electrically conductive trace, wherein the electrically conductive trace is vertically overlapping with the ground terminal along a vertical axis, and wherein the first portion of the structure is vertically overlapping with the electrically conductive trace and with the ground terminal along the vertical axis.
3 more elements
A package comprising:
- a substrate with a first side and a second side opposite the first side;
- a first die on the first side of the substrate and a second die on the second side of the substrate;
- an electrically conductive routing proximate to the first side of the substrate, wherein the electrically conductive routing electrically couples the first die with the second die;
- and
- a layer on the first side of the substrate, wherein a portion of the layer is between the first die and the second die, wherein a portion of the electrically conductive routing is between the portion of the layer and the second side of the substrate, wherein the layer is coupled to a ground terminal, the ground terminal beneath the portion of the electrically conductive routing, wherein the portion of the electrically conductive routing is vertically overlapping with the ground terminal along a vertical axis, and wherein the portion of the layer is vertically overlapping with the portion of the electrically conductive routing and with the ground terminal along the vertical axis.
2 more elements
A method comprising:
- providing a substrate having a first side and a second side opposite the first side, the substrate including a metal routing proximate to the first side of the substrate;
- and
- applying a shield that includes a metal to a portion of the first side of the substrate, wherein at least a portion of the metal routing is between the shield and the second side of the substrate, wherein the shield and the metal routing are electrically isolated from each other, wherein the shield is coupled to a ground terminal, the ground terminal beneath the portion of the metal routing, wherein the portion of the metal routing is vertically overlapping with the ground terminal along a vertical axis, and wherein the shield is vertically overlapping with the portion of the metal routing and with the ground terminal along the vertical axis.
Dependencies are inferred from the claim text.