Integrated circuit packages and methods

A semiconductor package comprising:

• a substrate;
• a package component bonded to the substrate by electrical connectors, the package component comprising:
• an integrated circuit die;
• an encapsulant around the integrated circuit die;
• and
• a semiconductor substrate over the integrated circuit die and the encapsulant;
• an underfill between the substrate and the package component, wherein the underfill surrounds the electrical connectors;
• and
• a frame structure attached to the substrate, wherein the frame structure encircles the package component in a top-down view, wherein the frame structure comprises a perforated region at each corner of the frame structure in the top-down view, and wherein each perforated region comprises a first perforation extending through a thickness of the frame structure.

A method of forming a semiconductor package, the method comprising:

• bonding a first side of a package component to a substrate;
• forming an underfill between the package component and the substrate;
• and
• attaching a ring structure to the substrate using an adhesive, wherein the ring structure encircles the package component in a top-down view, wherein a first opening is disposed in a first perforated region of the ring structure, wherein the first opening exposes a portion of the adhesive in the top-down view, and wherein the first perforated region is disposed in a first corner region of the ring structure.