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US 12,604,720 B2Granted
Through mold interconnect drill feature
AssigneeIntel Corporation
InventorsRobert M. Nickerson, Rees Winters, Purushotham Kaushik Muthur Srinath
Life of this patent
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Abstract
Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and a mold layer over the package substrate and around the first die. In an embodiment, the electronic package further comprises a through mold opening through the mold layer, and a through mold interconnect (TMI) in the through mold opening, wherein a center of the TMI is offset from a center of the through mold opening.
Claims20
An electronic system, comprising:
- a bottom package comprising a first package substrate having a top side and an opposite bottom side, a first die coupled to the top side of the first package substrate by interconnects, and underfill material around the interconnects and along an entirety of sidewalls of the first die, a first mold layer over the first package substrate and surrounding the underfill material and the first die, and a through mold interconnect through the first mold layer and laterally adjacent to the first die, the through mold interconnect comprising a first conductive portion on the top surface of the first package substrate, and a second conductive portion on the first conductive portion, the second conductive portion distinct from the first conductive portion, wherein the first conductive portion has a maximum lateral width greater than a maximum lateral width of the second conductive portion, and the bottom package comprising a second mold layer in contact with the first mold layer and a top surface of the first die, the second mold layer having a planar bottom surface along the top surface of the first die;
- and
- a top package coupled to the bottom package, the top package comprising a second package substrate having a top side and an opposite bottom side, a second die above and coupled to the top side of the second package substrate by a first wire bond, and a third die over the second die, the third die laterally offset from the second die, and the third die coupled to the top side of the second package substrate by a second wire bond, and a third mold layer over the second die and the third die and over the second package substrate, wherein the first die of the bottom package extends laterally beyond a sidewall of the third die.
An electronic system, comprising:
- a lower package comprising a first package substrate, a first die coupled to the first package substrate by first interconnects, and capillary underfill around the first interconnects and along an entirety of sidewalls of the first die, a first mold material over the first package substrate and surrounding the capillary underfill with a curved interface between the first mold material and the capillary underfill, and a second interconnect through the first mold material and laterally adjacent to the first die, the second interconnect comprising a first conductive portion on the first package substrate, and a second conductive portion on the first conductive portion, the second conductive portion distinct from the first conductive portion, wherein the first conductive portion has a maximum lateral width greater than a maximum lateral width of the second conductive portion, and the lower package comprising a second mold material in contact with the first mold material and a top surface of the first die, the second mold material having a planar bottom surface along the top surface of the first die;
- and
- an upper package coupled to the lower package, the upper package comprising a second package substrate, a second die above and coupled to the second package substrate by a first wire bond, and a third die over the second die, the third die laterally offset from the second die, and the third die coupled to the second package substrate by a second wire bond, and a third mold material over the second die and the third die and over the second package substrate, wherein the first die of the lower package extends laterally beyond a sidewall of the third die.
An electronic system, comprising:
- a first package substrate having a top side and an opposite bottom side;
- a first die coupled to the top side of the first package substrate by interconnects;
- underfill material around the interconnects and along an entirety of sidewalls of the first die;
- a first mold layer over the first package substrate and surrounding the underfill material and the first die;
- a through mold interconnect through the first mold layer and laterally adjacent to the first die, the through mold interconnect comprising a first conductive portion on the top surface of the first package substrate, and a second conductive portion on the first conductive portion, the second conductive portion distinct from the first conductive portion, wherein the first conductive portion has a maximum lateral width greater than a maximum lateral width of the second conductive portion;
- a second mold layer in contact with the first mold layer and a top surface of the first die, the second mold layer having a planar bottom surface along the top surface of the first die;
- a second package substrate above the first die, the second mold layer and the first mold layer, the second package substrate having a top side and an opposite bottom side;
- a second die above and coupled to the top side of the second package substrate by a first wire bond;
- a third die over the second die, the third die laterally offset from the second die, and the third die coupled to the top side of the second package substrate by a second wire bond, wherein the first die extends laterally beyond a sidewall of the third die;
- and
- a third mold layer over the second die and the third die and over the second package substrate.
8 more elements
Dependencies are inferred from the claim text.