Probe card configured to connect to a probe pad located in saw street of a semiconductor wafer

A system comprising a semiconductor wafer and a probe card for testing or trimming or programming the semiconductor wafer, the semiconductor wafer including:

• a first die including a first integrated circuit having a trimmable or programmable component, the trimmable or programmable component being configured to be trimmed or permanently altered in response to an electrical signal;
• a saw street arranged adjacent to the first die;
• a seal ring around the first die having a plurality of metal layers with vias between the plurality of metal layers;
• a plurality of stacked conductors with vias between the plurality of stacked conductors, the plurality of stacked conductors passing through a gap in the seal ring to provide a conductive path through the seal ring;
• and
• at least one probe pad electrically connected to the trimmable or programmable component, the at least one probe pad being arranged in the saw street and connected to the plurality of stacked conductors, the probe card including at least one probe arranged to make electrical contact with the at least one probe pad arranged in the saw street of the semiconductor wafer.