Loading patent…
AssigneeDisco Corporation
InventorsKazuki Sugiura, Takashi Mori, Yoshinori Kakinuma, Tetsuya Hosono, Kaoru Amano
Estimating the term…
A wafer transfer method for forming a second work unit by transferring a wafer of a first work unit including a first ring frame, a first adhesive tape, and the wafer to a second adhesive tape includes sandwiching a claw body between the first ring frame and a second ring frame, affixing the second adhesive tape to a surface of the wafer which surface is not affixed to the first adhesive tape, holding the wafer by the second ring frame via the second adhesive tape, and peeling off the first adhesive tape from the wafer.
A wafer transfer method for forming a second work unit by transferring a wafer of a first work unit to a second adhesive tape that is affixed to a second ring frame in such a manner as to close a second opening portion disposed in a center of the second ring frame, the first work unit including a first ring frame having a first opening portion disposed in a center of the first ring frame, a first adhesive tape affixed to the first ring frame in such a manner as to close the first opening portion, and the wafer affixed to the first adhesive tape in the first opening portion of the first ring frame, the wafer transfer method comprising:
A wafer transfer apparatus for forming a second work unit by transferring a wafer of a first work unit to a second adhesive tape that is affixed to a second ring frame in such a manner as to close a second opening portion disposed in a center of the second ring frame, the first work unit including a first ring frame having a first opening portion disposed in a center of the first ring frame, a first adhesive tape affixed to the first ring frame in such a manner as to close the first opening portion, and the wafer affixed to the first adhesive tape in the first opening portion of the first ring frame, the wafer transfer apparatus comprising:
Dependencies are inferred from the claim text.