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US 12,604,670 B2Granted
In-package magnetic switching using glass core technology
AssigneeIntel Corporation
InventorsNeelam Prabhu Gaunkar, Telesphor Kamgaing, Veronica Strong, Georgios C. Dogiamis, Aleksandar Aleksov
Life of this patent
Estimating the term…
Abstract
Embodiments disclosed herein comprise package substrates and methods of forming such package substrates. In an embodiment, a package substrate comprises a core, where the core comprises glass. In an embodiment, an opening if formed through the core. In an embodiment, a magnetic region is disposed in the opening.
Claims24
A package substrate, comprising:
- a core, wherein the core comprises glass;
- an opening through the core, wherein the opening has an hourglass shaped cross-section;
- a magnetic region disposed in the opening;
- and
- an unfilled opening in the core, the unfilled opening laterally spaced apart from the magnetic region in the opening.
2 more elements
An electronic package, comprising:
- a core;
- a buildup layer over the core;
- a plurality of openings through the core, wherein each of the plurality of openings has an hourglass shaped cross-section;
- a plurality of magnetic tunnel junctions (MTJs) in corresponding ones of the openings in the core, wherein the plurality of MTJs are coupled to each other to form a memory cell;
- and
- an unfilled opening in the core, the unfilled opening laterally spaced apart from the plurality of MTJs in the plurality of openings.
3 more elements
An electronic package, comprising:
- a core;
- a buildup layer over the core;
- a magnetic switch embedded in the core, wherein the magnetic switch comprises:
- an opening through the core, wherein the opening has an hourglass shaped cross-section;
- a first barrier layer in the opening;
- a magnetic layer below the first barrier in the opening;
- a second barrier layer below the magnetic layer in the opening;
- and
- a conductive trace adjacent to the magnetic layer;
- and
- an unfilled opening in the core, the unfilled opening laterally spaced apart from the opening of the magnetic switch.
8 more elements
An electronic system, comprising:
- a board;
- a package substrate coupled to the board, wherein the package substrate comprises:
- a core;
- a buildup layer over the core;
- an opening through the core, wherein the opening has an hourglass shaped cross-section;
- and
- a magnetic region disposed in the opening;
- an unfilled opening in the core, the unfilled opening laterally spaced apart from the magnetic region in the opening a die coupled to the package substrate.
5 more elements
A package substrate, comprising:
- a core, wherein the core comprises glass;
- an opening through the core;
- and
- a magnetic region disposed in the opening, wherein a channel configured for flowing a coolant is adjacent to the opening.
1 more element
Dependencies are inferred from the claim text.