Microled connection with cu bump on ti/al wire

An electronic device comprising:

• a first substrate made of glass or a resin;
• a first wiring formed on the first substrate;
• a first insulating layer being an inorganic insulating layer which is made of an inorganic material, the first insulating layer covering the first wiring;
• and
• a bump electrode connected to the first wiring at a position of overlapping a first opening formed in the first insulating layer, the bump electrode protruding from the first insulating layer,
• wherein the first wiring is a laminated film of:
• a first conductor layer, which is made of titanium or a titanium alloy and is formed on the first substrate;
• and
• a second conductor layer, which is made of aluminum or an aluminum alloy and is laminated on the first conductor layer, and
• the bump electrode includes:
• a first conductor portion, which is made of copper or a copper alloy and is bonded to the first wiring;
• and
• a second conductor portion, which is made of solder containing tin and is formed on the first conductor portion.