US 12,604,584 B2 · Liquid metal alloys in a light-emitting diode device

Abstract

The present disclosure relates to techniques for providing a liquid metal alloy in a light-emitting diode device that can both heal cracks formed in solder joints on the light-emitting diode (LED) device as well as improve thermal energy dissipation from the LED chips to improve the performance, reduce wear, and prolong the life of the LED chips. In an embodiment, a light-emitting diode device can include a liquid metal alloy containing gallium next to a solder joint, and when one or more cracks form, the liquid metal alloy can enter the cracks and solidify, healing the cracks. The liquid metal alloy can also be placed adjacent to, and in contact with the LED chip to transfer energy away from the LED chips.

Claims19

Dependent claims

A light-emitting diode device, comprising:

a printed circuit board (PCB);
a light-emitting diode package attached to the PCB via a solder joint;
and
a liquid metal alloy abutting the light-emitting diode package and the solder joint, wherein the liquid metal alloy is liquid at room temperature.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

17/943,556Filed 13 Sep 2022

Published

US 2024/0088337 A114 Mar 2024

Granted

14 Apr 2026

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

H10H 20/857
Packages: interconnections, e.g. lead-frames, bond wires or solder balls
H10H 20/8583
Means for heat extraction or cooling: not being in contact with the bodies
H10H 20/852
Packages: encapsulations
H10W 90/00
Package configurations

Liquid metal alloys in a light-emitting diode device

Life of this patent

Liquid metal alloys in a light-emitting diode device

Life of this patent

Abstract

Claims19