Hybrid microdisplay

A method of forming a display comprising:

• planarizing a backplane comprising a plurality of backplane electrical contacts to provide a first planarized surface;
• planarizing a monolithic light emitting diode structure comprising a plurality of electrical contacts corresponding to the plurality of backplane electrical contacts of the backplane to provide a second planarized surface;
• bonding the first planarized surface to the second planarized surface, wherein bonding comprises forming a reversible bond between at least one of the plurality of backplane electrical contacts and a corresponding electrical contact of the monolithic light emitting diode structure;
• and
• subsequently selectively etching the monolithic light emitting diode structure to provide a plurality of physically isolated light emitting diode dies, thereby to enable removal and/or replacement of at least one physically isolated light emitting diode die by reversing the reversible bond between the at least one of the plurality of backplane electrical contacts and the corresponding electrical contact of the monolithic light emitting diode structure;
• wherein the at least one of the plurality of backplane electrical contacts is reversibly bonded to the corresponding electrical contact of the monolithic light emitting diode structure using metal-to-metal bonding and/or eutectic bonding;
• wherein at least one of the reversible bonds is at least partially laterally surrounded by a dielectric layer thereby to separate the backplane and the monolithic light emitting diode structure, preferably wherein the dielectric layer comprises at least one of SiO2, Si3N4, Su-8, SrF2, PDMS and PMMA;
• and
• wherein the plurality of electrical contacts of the monolithic light emitting structure comprises a high reflectivity metal, preferably wherein the high reflectivity metal is one of Ni and Ag.