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US 12,604,581 B2Granted
Method for manufacturing electronic device
AssigneeInnolux Corporation
InventorsYuan-Lin Wu, Tsung-Han Tsai, Jia-Yuan Chen, Kuan-Feng Lee
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Abstract
A method for manufacturing an electronic device includes: providing a base layer; forming a patterned circuit layer on the base layer, the patterned circuit layer having a first opening; placing an electronic element on the patterned circuit layer; and patterning the base layer to form a second opening which is at least partially overlapped with the first opening. The step of placing the electronic element is performed after the step of forming the patterned circuit layer.
Claims12
A method for manufacturing an electronic device, comprising:
- providing a base layer;
- forming a patterned circuit layer on the base layer, the patterned circuit layer having a first opening;
- placing an electronic element on the patterned circuit layer;
- forming a first encapsulation portion on the electronic element after the step of placing the electronic element;
- forming a second encapsulation portion on the first encapsulation portion and a sidewall of the first opening;
- and
- patterning the base layer to form a second opening which is at least partially overlapped with the first opening after the step of forming the second encapsulation portion;
- wherein the step of placing the electronic element is performed after the step of forming the patterned circuit layer.
5 more elements
Dependencies are inferred from the claim text.