Contact etch stop layer for a pixel sensor
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsCheng-Hsien Chen, Yung-Hsiang Chen, Chia Hao Li, Yu-Lung Yeh, Yen-Hsiu Chen
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsCheng-Hsien Chen, Yung-Hsiang Chen, Chia Hao Li, Yu-Lung Yeh, Yen-Hsiu Chen
Estimating the term…
One or more semiconductor processing tools may deposit a contact etch stop layer on a substrate. In some implementations, the contact etch stop layer is comprised of less than approximately 12 percent hydrogen. Depositing the contact etch stop layer may include depositing contact etch stop layer material at a temperature of greater than approximately 600 degrees Celsius, at a pressure of greater than approximately 150 torr, and/or with a ratio of at least approximately 70:1 of NH3 and SiH4, among other examples. The one or more semiconductor processing tools may deposit a silicon-based layer above the contact etch stop layer. The one or more semiconductor processing tools may perform an etching operation into the silicon-based layer until reaching the contact etch stop layer to form a trench isolation structure.
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