Reduced-height image-capturing module

A reduced-height image-capturing module, comprising:

• a lens assembly;
• an image-sensing chip;
• a carrier base;
• and
• a circuit substrate;
• wherein the circuit substrate has a through opening;
• wherein the carrier base has a base body, two extending plate bodies extending laterally outward from an upper portion of the base body, and a base groove recessed downward from the upper portion of the base body of the carrier base;
• wherein a lower portion of the base body is configured to enter the through opening of the circuit substrate, and the two extending plate bodies cross over the through opening of the circuit substrate and are disposed on an upper surface of the circuit substrate;
• wherein the image-sensing chip is disposed on a recessed bottom surface of the base groove of the base body of the carrier base, and the recessed bottom surface of the base groove and the upper surface of the circuit substrate are not at a same level, so that the recessed bottom surface of the base groove is lower than the upper surface of the circuit substrate;
• wherein the lens assembly is disposed on the upper portion of the base body and corresponds to the image-sensing chip.