Trench patterning process using microcracking
AssigneeSanDisk Technologies LLC
InventorsMotoki Kawasaki, Shunsuke Takuma, Seiji Shimabukuro
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AssigneeSanDisk Technologies LLC
InventorsMotoki Kawasaki, Shunsuke Takuma, Seiji Shimabukuro
Estimating the term…
A method includes forming a first-tier structure over a substrate, forming first-tier trenches laterally extending along a first horizontal direction and laterally spaced apart from each other along a second horizontal direction through the first-tier structure, non-conformally depositing a plurality of material layers over the first-tier structure such that first-tier cavities are formed in volumes of the first-tier trenches that are not filled with the plurality of material layers, and inducing laterally-extending cracks in portions of the plurality of material layers that overlie the first-tier cavities, such that the laterally-extending cracks are connected to a respective underlying one of the first-tier cavities and vertically extend to a topmost material layer of the plurality of material layers.
A method, comprising:
Dependencies are inferred from the claim text.