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US 12,604,458 B2Granted
Apparatus comprising a metal portion in the top portion of capacitor structure, and related methods
AssigneeMicron Technology, Inc.
InventorsHarutaka Honda, Shogo Omiya, Shoko Norifusa, Hidekazu Nobuto
Life of this patent
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Abstract
An apparatus includes: a plurality of capacitors each including first and second conductive portions and a dielectric portion therebetween; a first conductive structure containing the plurality of capacitors therein, and electrically coupled to the second conductive portions of the plurality of capacitors; a second conductive structure on a top surface of the first conductive structure; and a third conductive structure on a top surface of the second conductive structure.
Claims17
An apparatus comprising:
- a plurality of capacitors, each capacitor including first and second conductive portions and a dielectric portion therebetween;
- a first conductive structure containing the plurality of capacitors therein, and electrically coupled to the second conductive portions of the plurality of capacitors;
- a second conductive structure on a top surface of the first conductive structure, wherein the second conductive structure covers the top surface of the first conductive structure;
- and
- a third conductive structure on a top surface of the second conductive structure.
2 more elements
An apparatus comprising:
- a memory array including a plurality of memory cells;
- a first conductive structure covering the memory array to contain the plurality of memory cells therein, the first conductive structure having a top surface and side surfaces;
- a second conductive structure on the top surface of the first conductive structure without covering the side surfaces of the first conductive structure;
- and
- a third conductive structure on a top surface of the second conductive structure without covering the side surfaces of the first conductive structure, wherein the second conductive structure and the third conductive structure comprise different materials.
2 more elements
Dependencies are inferred from the claim text.