Integrated device package with reduced thickness

A integrated device package comprising:

• a carrier;
• at least a first and second electronic components mounted to the carrier, the first and second electronic components having a first surface facing the carrier and a second surface opposite the first surface;
• a molding material disposed over the carrier, the molding material surrounding and between the first and second electronic components, the first electronic component embedded within the molding material, the second electronic component disposed in the molding material, the molding material having a lower surface facing the carrier and an upper surface opposite the lower surface and coplanar with the second surface of the second electronic component;
• a ground connection embedded within the molding material that extends from the carrier to a recess in the upper surface of the molding material, the ground connection positioned in the molding material between the first and second electronic components;
• a through mold via positioned in the molding material between the ground connection and the second electronic component to provide mechanical separation between a first portion of the molding material surrounding the first electronic component and a second portion of the molding material surrounding the second electronic component;
• and
• an electromagnetic interference shield layer disposed over the first and second electronic components, the recess, and the through mold via, the electromagnetic interference shield layer in contact with the ground connection exposed in the recess, the electromagnetic interference shield layer configured to shield the first and second electronic components from a radio frequency signal, an upper surface of the electromagnetic interference shield layer having a plurality of recesses, the plurality of recesses including markings.