Electronic converter designed on the basis of welding technologies

A converter comprising:

• at least one semiconductor module and a cooling housing,
• wherein the at least one semiconductor module comprises a semiconductor chip, a substrate having a first side opposite a second side, a base plate having a first side opposite a second side, and a molding compound,
• wherein the first side of the substrate is connected to the semiconductor chip,
• wherein the second side of the substrate is connected to the first side of the base plate,
• wherein the second side of the base plate has a first region and a second region,
• wherein the first region has a surface expansion in the form of a cooling structure, such that, in an operating state, the first region having the surface expansion is in direct contact with a coolant liquid,
• wherein the second region forms a closed path around the first region wherein the second regions extends perpendicular from the second side of the base plate in a protrusion direction to form a shoulder,
• wherein the cooling housing comprises a housing plate with at least one recess, and the second region of the base plate is welded to the housing plate around a corresponding one of the at least one recess,
• wherein the second side of the base plate comprises an edge and the second region coincides with the edge.