Module with improved thermal cooling performance

An apparatus, comprising:

• a) semiconductor chip package having a semiconductor chip therein, the semiconductor chip package to communicate a temperature of the semiconductor chip;
• b) a heat sink that is thermally coupled to the semiconductor chip package, the heat sink including fins;
• c) a fan to blow ambient air towards the heat sink;
• and
• d) a temperature sensing device, the temperature sensing device to sense a temperature of the ambient air before the ambient air is warmed by the fins, the temperature sensing device downstream of the fan along a flow path of the ambient air between the fan and the fins, a rotational speed of the fan to be determined from the temperature of the semiconductor chip and the temperature of the ambient air.