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US 12,604,415 B2Granted
Circuit board structure and method for manufacturing the same
AssigneeTong Hsing Electronic Industries, Ltd.
InventorsYu-Hsien Liao, Shih-Han Wu, Jhih-Wei Lai, Jian-Yu Shih, Ming-Yen Pan
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Abstract
A circuit board structure is provided. The circuit board structure includes a substrate, a solder mask coupler, a supporter, and a chip. The substrate has a conductive structure. The solder mask coupler is disposed on the substrate. The supporter contacts the solder mask coupler, and the supporter is fixed on the substrate via the solder mask coupler. The chip is disposed on the substrate, and the chip is electrically connected with the conductive structure.
Claims7
A circuit board structure, comprising:
- a substrate having a conductive structure;
- a solder mask coupler disposed on the substrate;
- a supporter contacting the solder mask coupler, wherein the solder mask coupler is sandwiched between the substrate and the supporter, and the solder mask coupler directly binds the substrate and the supporter to fix the supporter onto the substrate;
- and
- a chip disposed on the substrate, and being electrically connected with the conductive structure.
2 more elements
Dependencies are inferred from the claim text.