Multilayer electronic substrate
AssigneeSony Group Corporation
InventorsKanahiro Shirota, Keiichi Hirano
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AssigneeSony Group Corporation
InventorsKanahiro Shirota, Keiichi Hirano
Estimating the term…
Provided is a multilayer electronic substrate that includes a first substrate, a second substrate placed on the first substrate such that surfaces of the first and second substrates face each other, a first connector mounted on the surface of the first substrate and electrically connected to a first wire of the first substrate, a second connector mounted on the surface of the second substrate and electrically connected to a first wire of the second substrate, the second connector being directly connected to the first connector, and a wiring member having flexibility, the wiring member having one end electrically connected to a second wire of the first substrate and another end electrically connected to a second wire of the second substrate, to electrically connect the second wire of the first substrate and the second wire of the second substrate.
A multilayer electronic substrate, comprising:
Dependencies are inferred from the claim text.