Circuit board weld structure
AssigneeTaicang Manaflex Technology Co., Ltd.
InventorRobert C. Lane
Life of this patent
Estimating the term…
Abstract
A circuit board weld structure comprises a first circuit board connected with and a second circuit board. A surface of the first circuit board is provided with a first covering film, the first covering film is provided with a first through hole, and a first welding pad is formed on the surface of the first circuit board. A surface of the second circuit board is provided with a second covering film, the second covering film is provided with a second through hole, and a second welding pad is formed on the surface of the second circuit board. The first welding pad is welded or coupled to the second welding pad through a filler piece.
Claims20
A circuit board weld structure, comprising:
- a first circuit board having at least one surface, the at least one surface of the first circuit board being provided with a first covering film, the first covering film having a first through hole formed therein, and a first welding pad is formed on the surface of the first circuit board;
- a second circuit board having at least one surface, the at least one surface of the second circuit board being provided with a second covering film, the second covering film having a second through hole formed therein, and a second welding pad is formed on the surface of the second circuit board;
- and
- a filling piece having a first side and a second side opposite to the first side, the first side of the filling piece is welded to the first welding pad, and the second side of the filling piece is welded to the second welding pad.
A circuit board weld structure, comprising:
- a first circuit board, the first circuit board having a first surface to which a first film is coupled, the first surface also having a first welding pad coupled thereto, the first film defining a first through hole therein;
- a second circuit board, the second circuit board having a second surface to which a second film is coupled, the second surface also having a second welding pad coupled thereto, the second film defining a second through hole therein;
- and
- a filler piece having a first side and a second side opposite to the first side, the first side of the filler piece is welded to the first welding pad, and the second side of the filler piece is welded to the second welding pad.
A circuit board weld structure, comprising:
- a first circuit board made of a first metal, the first circuit board having a first surface to which a first covering film is coupled, the first surface also having a first welding pad coupled thereto, the first covering film defining a first through hole therein;
- a second circuit board made of a second metal, the second metal being different than the first metal, the second circuit board having a second surface to which a second covering film is coupled, the second surface also having a second welding pad coupled thereto, the second covering film defining a second through hole therein;
- and
- a filler piece having a first side and a second side opposite to the first side, the first side of the filler piece is welded to the first welding pad, and the second side of the filler piece is welded to the second welding pad.
Dependencies are inferred from the claim text.