Film package and package module including the same

A film package, comprising:

• a film substrate including a device region in a first direction and a reinforcing region adjacent to at least one side of the device region;
• a semiconductor chip having an elongated rod shape in a second direction orthogonal to the first direction, and the semiconductor chip on the device region;
• interconnection patterns on the film substrate, the interconnection patterns electrically connected to the semiconductor chip, and extending from the semiconductor chip onto the reinforcing region;
• a connection bump connecting the semiconductor chip and the interconnection patterns;
• and
• an underfill resin surrounding the connection bump,
• wherein each of the interconnection patterns is at a pitch in a range of 10 μm to 40 μm,
• wherein each space between adjacent interconnection patterns in a region adjacent to the at least one side is greater than each space between adjacent interconnection patterns in a region adjacent to the device region, and
• wherein at least a portion of the interconnection patterns have a bent region on the reinforcing region, and the bent region includes a first portion in the second direction, and a second portion bent from the first portion at an angle of 90° in the second direction.

A package module, comprising:

• a display panel;
• a driving printed circuit board below the display panel;
• and
• a film package that is bent between the display panel and the driving printed circuit board, the film package connecting the display panel and the driving printed circuit board, the film package configured to receive a signal output from the driving printed circuit board, and transmit the signal output from the driving printed circuit board to the display panel,
• wherein the film package includes
• a film substrate extending in a first direction and including a first side and a second side facing each other, the film substrate including a device region between the first side and the second side, and the film substrate including a reinforcing region adjacent to at least one side of the device region in a second direction intersecting the first direction;
• a semiconductor chip having an elongated rod shape, and the semiconductor chip on the device region of the film substrate in the first direction;
• interconnection patterns electrically connected to the semiconductor chip, the interconnection patterns comprising input patterns extending toward the first side on the film substrate and output patterns extending toward the second side on the film substrate;
• a protective layer on the film substrate to cover at least a portion of the interconnection patterns, and the protective layer including an opening in which the semiconductor chip is in the device region;
• a connection bump connecting the semiconductor chip and the interconnection patterns;
• and
• an underfill resin surrounding the connection bump in the opening,
• wherein each of the interconnection patterns is at a pitch in a range of 10 μm to 40 μm,
• wherein each space between adjacent interconnection patterns in a region adjacent to the first side is greater than each space between adjacent interconnection patterns in a region adjacent to the device region,
• wherein at least a portion of the input patterns have a bent region on the reinforcing region, and the bent region includes a first portion in the second direction, and a second portion bent from the first portion at an angle of 90° with respect to the second direction, and
• wherein the reinforcing region is bent between the display panel and the driving printed circuit board.