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US 12,604,369 B2Granted
Heat source device, substrate support device and substrate processing facility
AssigneeNPS Corporation
InventorsWon Sik Nam, Kang Heum Yeon, Dae Seok Song
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Abstract
The present inventive concept relates to a heat source device, a substrate support device, and a substrate processing facility comprising the same. According to the present inventive concept, a substrate can be uniformly heated and stably supported by a chamber having an inner space where the substrate is treated, and a substrate support device installed in the chamber to stably support the substrate and a heat source device installed in the chamber to uniformly heat the substrate.
Claims15
A heat source device for treating a substrate comprising
- a plurality of heat sources;
- and
- a support part provided with insertion holes formed to extend in one direction for inserting said heat sources, and grooves formed in one side of the insertion holes to collect and reflect radiations emitted from said heat sources,
- wherein the grooves comprise a plurality of first grooves formed in the support part to form a first group extending in a first direction that intersects with an extending direction of the insertion holes, and a plurality of second grooves formed in the support part to form a second group extending in a second direction that intersects with the extending direction of the insertion holes and is orthogonal to the first direction,
- wherein the first and second grooves are formed to have the same diameter, a length of the first group in the first direction is identical with a length of the second group in the second direction, and a length of the first group in the second direction is identical with a length of the second group in the first direction, and
- wherein the first group comprises a plurality of first grooves arranged in three columns and two rows, and the second group comprises a plurality of second grooves arranged in two columns and three rows.
3 more elements
Dependencies are inferred from the claim text.