Acoustic wave device and module
AssigneeSanan Japan Technology Corporation
InventorsYuki Koto, Shinichi Shioi
Life of this patent
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Abstract
An acoustic wave device includes a wiring substrate, a wiring substrate-side wiring formed on the wiring board, a chip substrate opposed to the wiring substrate, a chip substrate-side wiring formed on the chip substrate, a plurality of resonators formed on the chip substrate and electrically connected to the chip substrate-side wiring, a plurality of bumps electrically connected to the wiring substrate-side wiring and the chip substrate-side wiring, and a heat dissipation bump bonded to a region of the chip board-side wiring electrically connected to a plurality of resonators and insulated from the wiring substrate-side wiring.
Claims4
An acoustic wave device comprising:
- a wiring substrate;
- a wiring substrate-side wiring formed on the wiring substrate;
- a chip substrate opposed to the wiring substrate;
- a chip substrate-side wiring formed on the chip substrate;
- a plurality of resonators formed on the chip substrate and electrically connected to the chip substrate-side wiring;
- a plurality of bumps electrically connected to the wiring substrate-side wiring and the chip substrate-side wiring;
- a heat dissipation bump bonded to a region of the chip substrate-side wiring electrically connected to a plurality of resonators and insulated from the wiring substrate-side wiring;
- and
- a highly heat conductive insulating layer formed on the wiring substrate-side wiring, wherein the heat dissipation bump is in contact with the highly heat conductive insulating layer.
An acoustic wave device comprising:
- a wiring substrate;
- a wiring substrate-side wiring formed on the wiring substrate;
- a chip substrate opposed to the wiring substrate;
- a chip substrate-side wiring formed on the chip substrate;
- a plurality of resonators formed on the chip substrate and electrically connected to the chip substrate-side wiring;
- a plurality of bumps electrically connected to the wiring substrate-side wiring and the chip substrate-side wiring;
- a heat dissipation bump bonded to a region of the chip substrate-side wiring electrically connected to a plurality of resonators and insulated from the wiring substrate-side wiring,
- wherein the wiring substrate further comprising
- an insulating layer,
- a plurality of heat dissipation metallic layers stacked through the insulating layer and not electrically connected to the wiring substrate-side wiring,
- a heat dissipation via penetrating the insulating layer and electrically connected to the plurality of heat dissipation metallic layers,
- wherein the heat dissipation bump is bonded to one of the heat dissipation metallic layers formed on an exposed surface of the wiring substrate.
Dependencies are inferred from the claim text.