Power amplifier module with interleaved wirebonds

A Doherty amplifier, comprising:

• a first amplifier die including a first power transistor and having a first output terminal at which a first amplified signal is generated;
• a second amplifier die including a second power transistor with a second output terminal at which a second amplified signal is generated;
• an output transformer connected to an output terminal of the Doherty amplifier;
• a shunt inductance network;
• an impedance inversion element;
• a first wirebond array connected between the first output terminal of the first amplifier die and the output transformer;
• a second wirebond array connected between the second output terminal of the second amplifier die and the impedance inversion element;
• and
• a third wirebond array connected between the second output terminal of the second amplifier die the shunt inductance network, wherein wirebonds of the second wirebond array are interleaved with wirebonds of the third wirebond array.

An amplifier, comprising:

• a substrate;
• a first amplifier die on the substrate, the first amplifier die including a first power transistor and having a first output terminal at which a first amplified signal is generated;
• a second amplifier die on the substrate, the second amplifier die including a second power transistor with a second output terminal at which a second amplified signal is generated;
• a first electrical component on the substrate, the first electrical component including a first wirebond attach area;
• a second electrical component on the substrate, the second electrical component including a second wirebond attach area;
• a first wirebond array connected between the first output terminal of the first amplifier die and the first wirebond attach area;
• and
• a second wirebond array connected between the first output terminal of the first amplifier die and the second wirebond attach area, wherein wirebonds of the first wirebond array are interleaved with wirebonds of the second wirebond array.