High accuracy QCW pitch stack using sinter joints

A light emitting device, comprising:

• a plurality of emitter subassemblies, each emitter subassembly comprising:
• a plate-shaped light emitter having two sides and configured to emit light from an edge disposed between the two sides, and
• at least one plate-shaped submount attached to at least one side of the plate-shaped light emitter,
• wherein the plurality of emitter subassemblies is disposed parallel to one another and sintered to one another in such a manner as to form a light emitting diode stack, wherein a predefined pitch pattern defines distances between adjacent emitter subassemblies;
• and
• a cooler joined with the light emitting diode stack, the cooler having a plurality of cooling contacts arranged in parallel to one another and with relative distances from one another defined by the predefined pitch pattern such that each of the plurality of cooling contacts is aligned with a respective one of the plurality of emitter subassemblies.

A method for forming a light emitting device, the method comprising:

• providing a plurality of plate-shaped light emitters, each having two sides and being configured to emit light from an edge disposed between the two sides;
• providing a plurality of plate-shaped submounts;
• joining each of the plurality of plate-shaped light emitters on at least one of two sides of the plurality of plate-shaped submounts so as to form a plurality of emitter subassemblies;
• arranging the plurality of emitter subassemblies adjacent to and in parallel to one another;
• sintering each of the plurality of emitter subassemblies together to form a light emitting diode stack, the sintered emitter subassemblies being disposed with one or more predefined pitches relative to one another;
• and
• joining the sintered light emitting diode stack to a cooler, the cooler having cooling contacts arranged in parallel to one another and with the one or more predefined pitches between cooling contacts corresponding to the one or more predefined pitches such that each of the cooling contacts are aligned with a respective one of the emitter subassemblies.