US 12,603,192 B2 · Conductive resin composition

Abstract

A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a metal powder, a resin binder, and an organic solvent, wherein 20.0% by mass or more of the metal powder is a flaky metal powder, and 70.0% by mass or more of the resin binder is a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.

Claims15

Dependent claims

A conductive resin composition, comprising a metal powder, a resin binder, and an organic solvent,

wherein 20.0% by mass or more of the metal powder is a flaky metal powder, and 70.0% by mass or more of the resin binder is a silicone resin, wherein the silicone resin is a thermosetting silicone resin, wherein the thermosetting silicone resin has a hydroxy group and an epoxy group, and is cured by heating without using a curing agent, and a content of the resin binder is 2.5 to 35.0 parts by mass with respect to 100.0 parts by mass of the metal powder;
and
wherein when 1% strain is applied to the conductive resin composition at an angular frequency of 1 Hz, a value of a phase difference δ between the strain and a stress caused by the strain is in a range of 32 to 87° and/or a ratio of a viscosity of the conductive resin composition at a shear rate of 0.4 (1/s) to a viscosity thereof at a shear rate of 40 (1/s) is in a range of 1.5 to 60.0.

Dependencies are inferred from the claim text.

Conductive resin composition

Life of this patent

Conductive resin composition

Life of this patent

Abstract

Claims15