In situ wafer seal chuck defects identification
AssigneeApplied Materials, Inc.
InventorsGangadhar Sheelavant, Karthick Vasu, Prabhugouda Shekharagouda Hiregoudra, Randy A Harris, Aaron Juntunen
Life of this patent
Estimating the term…
Abstract
Exemplary wafer seal chuck assembly maintenance chambers may include a chamber body defining an open interior. The chambers may include a plurality of chuck assembly supports disposed within the open interior. The plurality of chuck assembly supports may be rotatable within the open interior. The chambers may include a tool arm that is positionable above the open interior. The chambers may include an imaging device mounted on a distal end of the tool arm.
Claims19
A wafer seal chuck assembly maintenance chamber, comprising:
- a chamber body defining an open interior;
- a plurality of chuck assembly supports disposed within the open interior, the plurality of chuck assembly supports being rotatable within the open interior;
- a tool arm that is positionable above the open interior;
- and
- an imaging device mounted on a distal end of the tool arm.
A wafer seal chuck assembly maintenance chamber, comprising:
- a chamber body defining an open interior;
- a plurality of chuck assembly supports disposed within the open interior, the plurality of chuck assembly supports being rotatable within the open interior;
- an imaging device that is positionable above the open interior;
- and
- a seal rinse assembly that is positionable over the open interior.
A method of inspecting a wafer seal chuck assembly, comprising:
- capturing an image of a wafer seal chuck assembly using an imaging device positioned above an open interior of a maintenance chamber;
- performing one or more digital image processing operations on the image;
- and
- identifying at least one defect associated with the wafer seal chuck assembly based on the one or more digital image processing operations, wherein the at least one defect comprises at least one of seal lip metal plate up, seal elastomer damage, seal retainer metal plate up, backing plate burnout, a missing clip from a backing plate, metal plate up on an electrical contact, a missing contact from an electrical contact, or a misaligned contact from an electrical contact.
Dependencies are inferred from the claim text.