Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component

A photosensitive resin composition comprising:

• (A) a polyimide precursor having a structural unit represented by the following formula (1);
• (B) a polymerizable monomer having two or more groups comprising a polymerizable unsaturated double bond;
• (C) a photopolymerization initiator;
• and
• (D) one or more selected from the group consisting of 2,2′,4,4′-tetrahydroxybenzophenone, 2,2′-dihydroxy-4,4′-dimethoxybenzophenone, 4-[ethyl (2-hydroxyethyl)amino]-4′-nitroazobenzene, (1E,6E)-1,7-bis(4-hydroxy-3-methoxyphenyl)-1,6-heptadiene-3,5-dione, and 1,7-bis(4-hydroxyphenyl)-1,6-heptadiene-3,5-dione:
• wherein in the formula (1), X1 is a tetravalent group having one or more aromatic groups;
• a —COOR1 group and a —CONH— group are on the ortho-position to each other;
• a —COOR2 group and a —CO— group are on the ortho-position to each other;
• Y1 is a divalent group having one or more aromatic groups;
• R1 and R2 are independently a hydrogen atom, a group represented by the following formula (2), or an aliphatic hydrocarbon group including 1 to 4 carbon atoms;
• provided that at least one of R1 and R2 is the group represented by the formula (2):
• wherein in the formula (2), R3 to R5 are independently a hydrogen atom or an aliphatic hydrocarbon group including 1 to 3 carbon atoms;
• and m is an integer of 1 to 10.