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US 12,601,937 B2Granted
Thermo-optic phase shifters for a photonics chip
AssigneeGlobalFoundries U.S. Inc.
InventorsBrian McGowan, Ping-Chuan Wang, Michal Rakowski, Sujith Chandran, Yusheng Bian
Life of this patent
Estimating the term…
Abstract
Structures for a thermo-optic phase shifter and methods of forming a thermo-optic phase shifter. The structure comprises an interconnect structure including a dielectric layer, a waveguide core on the dielectric layer, and a heater on the dielectric layer. The heater includes a resistive heating element positioned adjacent to the waveguide core.
Claims20
A structure for a thermo-optic phase shifter, the structure comprising:
- an interconnect structure including a first dielectric layer and a second dielectric layer on the first dielectric layer;
- a waveguide core on the first dielectric layer;
- a first heater on the first dielectric layer, the first heater including a first resistive heating element;
- a second heater on the first dielectric layer, the second heater including a second resistive heating element, and the waveguide core laterally between the first resistive heating element and the second resistive heating element;
- and
- a third heater on the second dielectric layer, the third heater including a third resistive heating element over the waveguide core.
3 more elements
A method of forming a structure for a thermo-optic phase shifter, the method comprising:
- forming an interconnect structure including a first dielectric layer and a second dielectric layer on the first dielectric layer;
- forming a waveguide core on the first dielectric layer;
- forming a first heater on the first dielectric layer, wherein the first heater includes a first resistive heating element positioned adjacent to the waveguide core;
- forming a second heater on the first dielectric layer, wherein the second heater includes a second resistive heating element, and the waveguide core is positioned laterally between the first resistive heating element and the second resistive heating element;
- and
- forming a third heater on the second dielectric layer, wherein the third heater includes a third resistive heating element over the waveguide core.
3 more elements
Dependencies are inferred from the claim text.