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US 12,601,047 B2Granted
Substrate processing method and selective deposition method using the same
AssigneesSK Specialty Co., Ltd, Industry-University Cooperation Foundation Hanyang University Erica Campus
InventorsSungWoong Chung, Junghun Kawk, Jihun Lee, Woohee Kim, Jeongmin Lee, Seohyun Lee
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Abstract
There is provided a substrate processing method. The method includes providing a substrate having a first surface area and a second surface area having a different surface state than that of the first surface area, exposing the substrate to a substrate surface treatment composition containing a deposition inhibitor, and exposing the substrate to a post-treatment composition containing HF.
Claims17
A substrate processing method comprising steps of:
- providing a substrate having a first surface area and a second surface area having a different surface state than that of the first surface area;
- exposing the substrate to a substrate surface treatment composition containing a deposition inhibitor;
- and
- after performing the step of exposing the substrate to the substrate surface treatment composition, exposing the substrate to a post-treatment composition containing HF, thereby removing deposition inhibitors adsorbed on any one of the first surface area and the second surface area.
1 more element
Dependencies are inferred from the claim text.