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US 12,600,884 B2Granted
Linerless film stack
Assignee3M Innovative Properties Company
InventorsJeffrey O. Emslander, Huiwen Tai, John A. Nielsen
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Abstract
A film stack is described. In particular, a film stack that includes a co-extrudable first base substrate, a first pressure sensitive adhesive, a release layer, a second pressure sensitive adhesive, and a second base substrate is described. Such film stacks may benefit from reduced waste, simpler manufacturing, and a thinner overall construction versus conventional film stacks.
Claims14
A film stack, comprising, in order:
- a first base substrate;
- a first pressure sensitive adhesive;
- a release layer;
- a second pressure sensitive adhesive;
- a second base substrate;
- wherein the first base substrate, the first pressure sensitive adhesive, the release layer, the second pressure sensitive adhesive, and the second base substrate are co-extrudable, further comprising at least one of a first protective layer disposed on the first base substrate opposite the first pressure sensitive adhesive and a second protective layer disposed on the second base substrate opposite the second pressure sensitive adhesive wherein the at least one of a first protective layer and the second protective layer includes a polyolefin.
3 more elements
Dependencies are inferred from the claim text.