Semiconductor structure and method of manufacturing the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJheng-Hong Jiang, Shing-Huang Wu, Chia-Wei Liu
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Abstract
A semiconductor structure is provided. The semiconductor structure includes a substrate; a fixed structure, disposed on the substrate; a floating structure, connected to the fixed structure and separated from the substrate, wherein a first surface of the floating structure facing the substrate includes a plurality of recesses; and a capping layer, disposed on the first surface of the floating structure, wherein the capping layer exposes a portion of the floating structure.
Claims20
A semiconductor structure, comprising:
- a substrate;
- a fixed structure, disposed on the substrate;
- a floating structure, connected to the fixed structure and separated from the substrate, wherein a first surface of the floating structure facing the substrate includes a plurality of recesses from a cross-sectional view;
- and
- a capping layer, disposed on the first surface of the floating structure, wherein the capping layer covers a bottom and sidewalls of at least one of the recesses and exposes a portion of the first surface of the floating structure outside the recesses.
A semiconductor structure, comprising:
- a substrate;
- a fixed structure, disposed on the substrate;
- a floating structure, connected to the fixed structure and separated from the substrate and including a first protruding portion and a second protruding portion extending away from the substrate;
- a first buffering structure covering sidewalls of the first protruding portion of the floating structure;
- and
- a second buffering structure covering sidewalls of the second protruding portion of the floating structure, wherein the first buffering structure and the second buffering structure comprise different materials,
- wherein a topmost surface of the first buffering structure is aligned with a topmost surface of the second buffering structure.
A semiconductor structure, comprising:
- a substrate;
- a fixed structure, wherein the fixed structure comprises a bottom disposed on the substrate;
- a first conductive layer, connected to the fixed structure and separated from the substrate, wherein a top surface of the first conductive layer includes a planar portion and a first concave portion, and the first concave portion includes a first tilted surface tilted with respect to a bottom surface of the first conductive layer;
- a second conductive layer, connected to the fixed structure and over the first conductive layer;
- and
- a capping layer, disposed between the first conductive layer and the second conductive layer, and in contact with the top surface of the first conductive layer,
- wherein the first conductive layer, the second conductive layer and the capping layer are coupled to a sidewall of the fixed structure.
Dependencies are inferred from the claim text.