Multilayer structure and packaging material comprising same
AssigneeKuraray Co., Ltd.
InventorMakoto Suzuki
Life of this patent
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AssigneeKuraray Co., Ltd.
InventorMakoto Suzuki
Estimating the term…
There is provided a multilayer structure having a hard layer (A) and either a resin composition layer (B1) or a resin composition layer (B2), wherein the hard layer (A) has a puncture strength of 40 N/mm or more and 150 N/mm or less; the resin composition layer (B1) is made of a resin comprising an ethylene-vinyl alcohol copolymer (b1) having a melting point Tm1 of 170° C. or more and an ethylene-vinyl alcohol copolymer (b2) having a melting point Tm2 of less than 170° C.; and the resin composition layer (B2) is made of a resin comprising a modified ethylene-vinyl alcohol copolymer containing a modifying group having a primary hydroxy group represented by formula (I). The multilayer structure is excellent in mechanical strength and thermal formability, and when being recovered, allows for melt kneading with less hard spots due to resin deterioration (gelation), showing excellent recyclability.
A multilayer structure comprising:
Dependencies are inferred from the claim text.