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US 12,600,135 B2Granted
Polymer based conductive paths for fluidic dies
AssigneeHewlett-Packard Development Company, L.P.
InventorsBo Song, Jacob Sterle, Tsuyoshi Yamashita
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Abstract
In example implementations, a fluidic die is provided. The fluidic die includes a silicon sliver with a plurality of nozzles to eject a printing fluid. A conductive path is deposited along a length of the silicon sliver on opposite sides of the silicon sliver. The conductive path and a portion of the silicon sliver are encapsulated by an epoxy molding compound.
Claims11
A fluidic die, comprising:
- a silicon sliver, wherein the silicon sliver comprises a plurality of nozzles to eject printing fluid;
- a polymer based conductive path deposited along a length of the silicon sliver on opposite sides of the silicon sliver;
- and
- an epoxy molding compound to encapsulate the polymer based conductive path and a portion of the silicon sliver.
1 more element
A fluid ejection device, comprising:
- a reservoir body to store a printing fluid;
- and
- a printhead coupled to the reservoir body, wherein the printhead comprises:
- an electrical pad;
- and
- a fluidic die electrically connected to the electrical pad, wherein the fluidic die comprises polymer based conductive paths in contact with silicon slivers, wherein the conductive paths and the silicon slivers are encapsulated within an epoxy molding compound.
3 more elements
Dependencies are inferred from the claim text.