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US 12,600,062 B2Granted
Method and device for detaching a stamp
AssigneeEV Group E. Thallner GmbH
InventorRobert Breyer
Life of this patent
Estimating the term…
Abstract
The invention relates to a method for detaching a stamp from a substrate, in particular from a master stamp and/or from a product. The stamp is deformed in a direction of the substrate in order to detach the stamp from the susbtrate.
Claims1
A device for detaching a stamp from a substrate, comprising:
- a carrier in contact with the stamp;
- and
- a carrier form element configured to deform and tension the carrier in contact with the stamp to deform the stamp in a direction of the substrate in order to detach the stamp in contact with the carrier from the substrate, the carrier form element comprising:
- at least one carrier form element elevation over which the carrier is stretched and in contact therewith, the carrier form element elevation being configured to lift a carrier stamp side of the carrier off of a remaining part of the carrier form element when the carrier is tensioned;
- and
- at least one fixing element configured to fix the carrier and deliver a gas and/or a gas mixture to an intermediate space between the carrier form element and the carrier.
3 more elements
Dependencies are inferred from the claim text.