Sensor chips having columnar microstructures embedded and surrounded by adhesive layer in a package structure and manufacturing method thereof

A manufacturing method of a sensor package structure, comprising:

• a preparing step implemented by providing a wafer and a plurality of light-permeable sheets that are separate from each other, wherein the wafer defines a plurality of sensor chips connected to each other, and a size of each of the sensor chips is greater than a size of any one of the light-permeable sheets, and wherein each one of the sensor chips has a sensing region formed on a top surface thereof and a plurality of columnar microstructures that are formed on a bottom surface thereof;
• a first bonding step implemented by adhering the top surface of each of the sensor chips with one of the light-permeable sheets through an annular adhering layer sandwiched therebetween, wherein each of the sensor chips, the corresponding annular adhering layer, and the corresponding light-permeable sheet are jointly defined as a sensing module and jointly define an enclosed space therein, and wherein, in any one of the sensing modules, the sensing region of the sensor chip is arranged in the enclosed space, and a plurality of connection pads of the sensor chip are arranged outside of the annular adhering layer;
• a slicing step implemented by holding and slicing the wafer to separate the sensing modules from each other;
• and
• a second bonding step implemented by fixing one of the sensing modules onto an upper surface of a substrate through a fixing adhesive layer and wire-bonding a plurality of bonding pads of the substrate and the connection pads of the one of the sensing modules through metal wires, wherein the columnar microstructures of the sensor chip of the one of the sensing modules are embedded in the fixing adhesive layer, where a thickness of the fixing adhesive layer is greater than a thickness of any one of the columnar microstructures such that the columnar microstructures are not in contact with the substrate.