Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorWei-Hao Chang
Life of this patent
Estimating the term…
Abstract
A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first circuit layer, a second circuit layer under the first circuit layer, a first electronic component between the first circuit layer and the second circuit layer and connected to the first circuit layer and a sub-package between the first circuit layer and the second circuit layer and connected to the second circuit layer. The sub package comprises a second electronic component under the first electronic component and a conductive structure configured to dissipate heat generated from the first electronic component.
Claims9
An electronic device, comprising:
- a first circuit structure;
- a first electronic component disposed under the first circuit structure;
- a package structure disposed under the first circuit structure and comprising a second electronic component under the first electronic component and a conductive structure configured to dissipate heat generated from the first electronic component, wherein the package structure comprises a first encapsulant covering the second electronic component;
- and
- a second encapsulant covering the first electronic component and the package structure.
Dependencies are inferred from the claim text.