Three-dimensional integrated circuit
AssigneeKV Innovations, LLC
InventorsKambiz Vafai, Sainan Lu
Life of this patent
Estimating the term…
Abstract
A three-dimensional integrated circuit device can include a group of die, a device layer and a thermal interface material formed above the substrate. A heat spreader can be located above the die, the device layer and the thermal interface material. The heat spreader can include a heat pipe comprising a rectangular-shaped heat pipe or disk-shaped heat pipe. A heat sink can be located above the heat spreader. The heat sink can include the heat pipe comprising the rectangular-shaped heat pipe or the disk-shaped heat pipe.
Claims18
A three-dimensional (3D) integrated circuit device, comprising:
- a thermal interface material layer configured above or from a substrate;
- a plurality of die, a device layer and a micro-bump thermal interface material layer formed above thermal interface material layer;
- a heat spreader located above the plurality of die, the device layer and the thermal interface material, the heat spreader comprising a flat-shaped heat pipe selected from a rectangular-shaped heat pipe and a disk-shaped heat pipe;
- and
- a heat sink located above the heat spreader, the heat sink selected from the rectangular-shaped heat pipe and the disk-shaped heat pipe, wherein the flat-shaped heat pipe is employed as both the heat spreader and the heat sink to improve a thermal performance of the 3D IC.
A three-dimensional (3D) integrated circuit device, comprising:
- a thermal interface material layer configured above or from a substrate;
- a plurality of die, a device layer and a micro-bump thermal interface material layer formed above thermal interface material layer, the plurality of die interconnected using a core-concentrated TSV arrangement;
- a heat spreader located above the plurality of die, the device layer and the thermal interface material, the heat spreader comprising a flat-shaped heat pipe selected from a rectangular-shaped heat pipe and a disk-shaped heat pipe, the flat-shaped heat pipe configured to reduce hotspot temperatures for high-power processor applications;
- and
- a heat sink located above the heat spreader, the heat sink selected from the rectangular-shaped heat pipe and the disk-shaped heat pipe, wherein the flat-shaped heat pipe is employed as both the heat spreader and the heat sink to improve a thermal performance of the 3D IC.
A method of operating a three-dimensional (3D) integrated circuit device, the method comprising:
- providing a 3D integrated circuit device comprising:
- a substrate;
- a thermal interface material (TIM) layer formed above the substrate;
- a plurality of die and a device layer stacked above the TIM layer and interconnected by micro-bumps;
- a heat spreader located above the plurality of die and the device layer, the heat spreader comprising a flat-shaped heat pipe selected from a rectangular-shaped heat pipe and a disk-shaped heat pipe;
- and a heat sink located above the heat spreader, the heat sink comprising a flat-shaped heat pipe selected from the rectangular-shaped heat pipe and the disk-shaped heat pipe;
- providing electrical power to the plurality of die to operate the device layer;
- and
- dissipating heat generated by the plurality of die through the TIM layer, the flat-shaped heat pipe heat spreader, and the flat-shaped heat pipe heat sink, thereby reducing hotspot temperatures in the 3D integrated circuit device.
Dependencies are inferred from the claim text.