Integrated circuit device
AssigneeSeiko Epson Corporation
InventorsTakanori Iwawaki, Motoaki Nishimura, Yoshihiko Nimura, Katsumi Inoue
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AssigneeSeiko Epson Corporation
InventorsTakanori Iwawaki, Motoaki Nishimura, Yoshihiko Nimura, Katsumi Inoue
Estimating the term…
An integrated circuit device includes a heating element, and a temperature sensor configured to detect a temperature of the heating element. An outer shape of the integrated circuit device has a first side and a second side intersecting the first side, and when a direction along the first side of the integrated circuit device is set as an X direction and a direction along the second side is set as a Y direction, the heating element includes a first heating element, and a second heating element arranged adjacent to the first heating element along the Y direction with a region AR interposed therebetween. The temperature sensor is arranged at an arrangement position where a position in the X direction is a position between a center of the region AR and the second side, and a position in the Y direction is a position between the first heating element and the second heating element.
An integrated circuit device, comprising:
Dependencies are inferred from the claim text.