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US 12,598,692 B2Granted
Locking tensioner cooling assembly for pluggable electronic component
AssigneeIntel Corporation
InventorsPrabhakar Subrahmanyam, Mark E. Sprenger
Life of this patent
Estimating the term…
Abstract
An apparatus is described. The apparatus includes a cooling assembly. The cooling assembly includes a cooling mass; a first heat spreader; a second heat spreader; a spring element; and, hinge components to form a hinge that the first and second heat spreaders rotate about. The spring element to apply a force to the first and second heat spreaders that causes the first and second heat spreaders to rotate about the hinge toward a circuit board located between the first and second heat spreaders.
Claims18
An apparatus, comprising:
- a cooling assembly comprising i), ii), iii), iv), v), and vi) below:
- i) a cooling mass;
- ii) a first heat spreader;
- iii) a second heat spreader;
- iv) a spring element to be coupled to the first and the second heat spreaders;
- v) a hinge component to form a hinge that the first and the second heat spreaders rotate about, the spring element to apply a force to the first and the second heat spreaders that causes the first and the second heat spreaders to rotate about the hinge toward a circuit board located between the first and the second heat spreaders wherein a first end of the first heat spreader comprises an angled support arm that couples to the cooling mass and a first end of the second heat spreader also comprises an angled support arm that couples to the cooling mass;
- and
- vi) a wedge element, the wedge element to be inserted between the first and the second heat spreaders to induce rotation of the first and the second heat spreaders toward the circuit board.
5 more elements
An apparatus, comprising:
- a pluggable module, the pluggable module comprising a circuit board, the circuit board comprising a first side having a first semiconductor chip package and a second, opposite side having a second semiconductor chip package, the pluggable module comprising a connector, the connector connecting the pluggable module into a system;
- a cooling assembly comprising i), ii), iii), iv), v), and vi) below:
- i) a cooling mass;
- ii) a first heat spreader that is thermally coupled to the first semiconductor chip package on a first side of the circuit board;
- iii) a second heat spreader that is thermally coupled to the second semiconductor chip package on a second side of the circuit board that is opposite the first side;
- iv) a spring element coupled to the first and the second heat spreaders;
- v) a hinge, the first heat spreader pressed against the first semiconductor chip package and the second heat spreader pressed against the second semiconductor chip package in response to rotational forces about the hinge induced by the spring element wherein a first end of the first heat spreader comprises an angled support arm that couples to the cooling mass and a first end of the second heat spreader also comprises an angled support arm that couples to the cooling mass;
- and
- vi) a wedge element, the wedge element to be inserted between the first and the second heat spreaders to induce rotation of the first and the second heat spreaders toward the circuit board.
6 more elements
An apparatus, comprising:
- a wedge element;
- a first heat spreader to be placed in thermal contact with a semiconductor chip package on a first side of a circuit board, the first heat spreader comprising a first hinge component;
- and,
- a second heat spreader to be placed in thermal contact with a second semiconductor chip package on a second, opposite side of the circuit board, the second heat spreader comprising a second hinge component, the first and second hinge components to form a hinge, the first and the second heat spreaders to rotate about the hinge toward the circuit board in response to the wedge element being inserted between the first and the second heat spreaders.
1 more element
Dependencies are inferred from the claim text.