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US 12,597,531 B2Granted
Package structure and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsWu Chou Hsu, Hung Yi Chuang, Shin-Luh Tarng
Life of this patent
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Abstract
A package structure and a method of manufacturing the same are provided. The package structure includes an electronic component and a first connection element. The electronic component includes a conductive wire and a magnetic layer encapsulating the conductive wire. The first connection element is electrically connected to the conductive wire. The first connection element is disposed outside the magnetic layer.
Claims9
A package structure, comprising:
- an electronic component comprising a conductive wire and a magnetic layer encapsulating the conductive wire;
- a first connection element electrically connected to the conductive wire, wherein the first connection element is disposed outside the magnetic layer;
- and
- an encapsulant encapsulating the conductive wire and separating the first connection element from the magnetic layer, wherein the first connection element has a first surface exposed by an upper surface of the encapsulant and a second surface exposed by a lower surface, opposite to the upper surface, of the encapsulant.
1 more element
Dependencies are inferred from the claim text.