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US 12,595,365 B2Granted
Resin composition
AssigneeNan Ya Plastics Corporation
InventorsTe-Chao Liao, Hung-Yi Chang, Chia-Lin Liu, Wei-Ru Huang
Life of this patent
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Abstract
A resin composition is provided. The resin composition includes a resin and an inorganic filler. The resin includes a bismaleimide resin and a polyphenylene ether resin. The inorganic filler includes a first inorganic filler and a second inorganic filler. An average particle size of the first inorganic filler is 0.3 μm to 0.6 μm. An average particle size of the second inorganic filler is 20 μm to 50 μm.
Claims15
A resin composition, comprising:
- a resin comprising a bismaleimide resin and a polyphenylene ether resin;
- and
- an inorganic filler comprising a first inorganic filler and a second inorganic filler, wherein an average particle size of the first inorganic filler is 0.3 μm to 0.6 μm, an average particle size of the second inorganic filler is 20 μm to 50 μm,
- wherein a weight ratio of a usage amount of the first inorganic filler to a usage amount of the second inorganic filler is 1:1 to 1:3.
1 more element
Dependencies are inferred from the claim text.